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Specialty Materials for Electronic Assembly
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Silicone Potting/Encapsulant Gels
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Silicone Potting/Encapsulant Gels
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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
Functioning as dielectric insulation
Protecting the circuit from moisture and other contaminants
Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.
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Item #
Item Name
Specific Gravity
Type
Color
Gel Hardness
Shelf Life
3-4170
Dow Dielectric Gel Kit
0.97/0.96
g/cc
Standard Gels
Clear
85
g
12 months
3-4680
Dow Silicone Gel Kit
0.97
g/cc
Standard Gels
Transparent blue
90
g
12 months
527
Sylgard® A & B Silicone Dielectric Gel Clear & Red
0.95
g/cc
Standard Gels
Clear or red
120
g
12 months
3-4222
Dow Dielectric Firm Gel Kit
0.97
g/cc
Toughened Gels
Translucent green
270
g
12 months
3-4241
Dow Dielectric Tough Gel Kit
0.97/0.98
g/cc
Toughened Gels
Translucent green
N/A
12 months
EG-3000
Dow Thixotropic Gel Parts A & B
1.00
g/cc
Speciality Gels
Clear/hazy
90
g
12 months
Results 1 - 6 of 6
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