Item # 3-4680, Dow Silicone Gel Kit On Robert McKeown Co., Inc.

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	Item # 3-4680, Dow Silicone Gel Kit

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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:

Functioning as dielectric insulation
Protecting the circuit from moisture and other contaminants
Relieving mechanical and thermal stress on components

Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.

Specifications · Product Form · Features

Specifications

Specific Gravity¹

0.97 g/cc

Type

Standard Gels

Cure System

Addition cure

Color

Transparent blue

Viscosity [cPs or mPa·s]

275

Penetration [1/10 of mm]

Gel Hardness

90 g

Shelf Life²

12 months

Working Time

< 10 min

Room Temperature Cure Time³

15 min/30 min

Heat Cure Time

1.5 at 125 ºC

Dielectric Strength

400 V/mil
16 kV/mm

Dielectric Constant at 100 Hz/100 kHz

2.75/2.75

Volume Resistivity

3.60E+15 O/cm

Dissipation Factor at 100 Hz/100 kHz

0.0004/< 0.00006

Linear Coefficient of Thermal Expansion

435 µm/(m·ºC)

¹ Cured or uncured A & B.
² Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
³ Time to non-flow/full cure.

Product Form

3.60E+15

Features