Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulant Gels > Item # 527  
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Item # 527, Sylgard® A & B Silicone Dielectric Gel Clear & Red


Silicone-Potting-Encapsulant-Gels

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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.




Specifications  · Product Form  · Features

Specifications

Specific Gravity1
0.95 g/cc

Type
Standard Gels

Cure System
Addition cure

Color
Clear or red

Viscosity [cPs or mPa·s]
475

Penetration [1/10 of mm]
45

Gel Hardness
120 g

Shelf Life2
12 months

Working Time
90 min

Room Temperature Cure Time3
24 h/> 1 week

Heat Cure Time
210 at 100 ºC
35 at 150 ºC
75 at 125 ºC

Dielectric Strength
385 V/mil
15 kV/mm

Dielectric Constant at 100 Hz/100 kHz
2.85/2.85

Volume Resistivity
7.00E+15 O/cm

Dissipation Factor at 100 Hz/100 kHz
0.002/0.0001
1 Cured or uncured A & B.
2 Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
3 Time to non-flow/full cure.


Product Form
7.00E+15


Features

0.002/0.0001