Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulant Gels > Item # 3-4222  
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Item # 3-4222, Dow Dielectric Firm Gel Kit


Silicone-Potting-Encapsulant-Gels

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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.




Specifications  · Product Form  · Features

Specifications

Specific Gravity1
0.97 g/cc

Type
Toughened Gels

Cure System
Addition cure

Color
Translucent green

Viscosity [cPs or mPa·s]
325

Penetration [1/10 of mm]
39 Shore 00 (Measured by durometer rather than penetration.)

Gel Hardness
270 g

Shelf Life2
12 months

Working Time
3 min

Room Temperature Cure Time3
30 min/60 min

Heat Cure Time
1 at 125 ºC
2 at 100 ºC

Dielectric Strength
350 V/mil
14 kV/mm

Dielectric Constant at 100 Hz/100 kHz
2.64/2.64

Volume Resistivity
1.00E+15 O/cm

Dissipation Factor at 100 Hz/100 kHz
0.0007/0.0002

Linear Coefficient of Thermal Expansion
320 µm/(m·ºC)
1 Cured or uncured A & B.
2 Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
3 Time to non-flow/full cure.


Product Form

2-part, translucent green, 1:1 mix ratio, fast room-temperature-cure gel with conditional primerless adhesion


Features

Fast room-temperature cure; blue and yellow parts turn green when mixed; conditional primerless adhesion at room temperature

Under certain conditions in specific designs or applications, Dielectric Firm Gels may lose adhesion. Full environmental exposure testing is recommended.