Item # 3-4170, Dow Dielectric Gel Kit On Robert McKeown Co., Inc.

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	Item # 3-4170, Dow Dielectric Gel Kit

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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:

Functioning as dielectric insulation
Protecting the circuit from moisture and other contaminants
Relieving mechanical and thermal stress on components

Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.

Specifications · Product Form · Features

Specifications

Specific Gravity¹

0.97/0.96 g/cc

Type

Standard Gels

Cure System

Addition cure

Color

Clear

Viscosity [cPs or mPa·s]

475

Penetration [1/10 of mm]

Gel Hardness

85 g

Shelf Life²

12 months

Working Time

> 24 h

Heat Cure Time

3 at 150 ºC
5 at 125 ºC
9 at 100 ºC

Dielectric Strength

500 V/mil
20 kV/mm

Dielectric Constant at 100 Hz/100 kHz

2.85/2.85

Volume Resistivity

9.50E+14 O/cm

Dissipation Factor at 100 Hz/100 kHz

0.0016/0.00007

Linear Coefficient of Thermal Expansion

425 µm/(m·ºC)

¹ Cured or uncured A & B.
² Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.

Product Form

9.50E+14

Features