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Specialty Materials for Electronic Assembly
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Item # EG-3000
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Item # EG-3000, Dow Thixotropic Gel Parts A & B
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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
Functioning as dielectric insulation
Protecting the circuit from moisture and other contaminants
Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.
Specifications
·
Product Form
·
Features
Specifications
Specific Gravity
1
1.00
g/cc
Type
Speciality Gels
Cure System
Addition cure
Color
Clear/hazy
Viscosity [cPs or mPa·s]
2300
Penetration [1/10 of mm]
60
Gel Hardness
90
g
Shelf Life
2
12 months
Working Time
6
h
Heat Cure Time
60 at 150 ºC
Dielectric Strength
550
V/mil
22
kV/mm
Dielectric Constant at 100 Hz/100 kHz
-12.1
Volume Resistivity
2.70E+14
O/cm
1
Cured or uncured A & B.
2
Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
Product Form
2-part, translucent, 1:1 mix ratio, thixotropic gel
Features
Heat cure gel; thixotropic to allow selective and cost effective protection