Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulant Gels > Item # EG-3000  
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Item # EG-3000, Dow Thixotropic Gel Parts A & B



Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.





Specifications  · Product Form  · Features

Specifications

Specific Gravity1

1.00 g/cc

Type

Speciality Gels

Cure System

Addition cure

Color

Clear/hazy

Viscosity [cPs or mPa·s]

2300

Penetration [1/10 of mm]

60

Gel Hardness

90 g

Shelf Life2

12 months

Working Time

6 h

Heat Cure Time

60 at 150 ºC

Dielectric Strength

550 V/mil
22
kV/mm

Dielectric Constant at 100 Hz/100 kHz

-12.1

Volume Resistivity

2.70E+14 O/cm
1 Cured or uncured A & B.
2 Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.


Product Form

2-part, translucent, 1:1 mix ratio, thixotropic gel



Features

Heat cure gel; thixotropic to allow selective and cost effective protection