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Specialty Materials for Electronic Assembly
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Paper Backing Substrates
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Paper tapes are designed to provide high temperature and excellent solvent resistance for wave soldering, printed circuit board masking, and hot air leveling applications. Service temperatures range from -100°F to 500°F (-73°C to +260°C).
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Part Number
Color
Adhesive System
Backing Thickness
Adhesive Thickness
Total Thickness
Adhesion Strength
C680
Natural
S
4.0
mil
0.102
mm
2.0
mil
0.051
mm
6.0
mil
0.152
mm
30
oz/in
331
g/cm
C663
Red
S
6.5
mil
0.165
mm
3.0
mil
0.076
mm
9.5
mil
0.241
mm
60
oz/in
661
g/cm
Results 1 - 2 of 2
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