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Specialty Materials for Electronic Assembly
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Paper Electronic Tapes
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Paper Backing Substrates
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Part Number C680
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Part Number C680, Paper Backing Substrates
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Paper tapes are designed to provide high temperature and excellent solvent resistance for wave soldering, printed circuit board masking, and hot air leveling applications. Service temperatures range from -100°F to 500°F (-73°C to +260°C).
Specifications
Color
Natural
Adhesive System
S
Backing Thickness
4.0
mil
0.102
mm
Adhesive Thickness
2.0
mil
0.051
mm
Total Thickness
6.0
mil
0.152
mm
Adhesion Strength
30
oz/in
331
g/cm
Tensile Strength
25
lb/in
4.5
kg/cm
Elongation
5
%
Insulation Class
155
ºC
Min Temperature Range
-20
ºF
-29
ºC
Max Temperature Range
310
ºF
154
ºC
Comments
Static Dissipative (ESD)