Specialty Materials for Electronic Assembly
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Adhesive Product

 
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Adhesive Product

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Our adhesive product line includes a series of one and two part room and thermal cure epoxy adhesives as well as UV curable adhesives. These adhesives are used in a wide range of applications meeting the customers' most demanding requirements: high strength at elevated temperatures, low stress for mismatched thermal expansion applications and outstanding chemical resistance for harsh environments.



   
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Item #

Type

Viscosity at 25 ºC

Cure Schedule

Specific Gravity

Hardness

Tensile Strength
104 A/B High Temperature 25000 cps Heat 1.4 g/cc 90 D 12.4 psi
285/Catalyst 9 Thermally Conductive Paste Room Temperature 2.27 g/cc N/A 2100 psi
285/Catalyst 11 Thermally Conductive Paste Heat 2.27 g/cc N/A 2100 psi
285/Catalyst 23LV Thermally Conductive Paste Room Temperature 2.18 g/cc N/A 2100 psi
  Results 1 - 4 of 4 1