Specialty Materials for Electronic Assembly
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All Categories > Adhesives & Sealants > Epoxy Adhesive/Sealants > Electronic Epoxy Adhesive/Sealants > Adhesive Product > Item # 104 A/B  
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Item # 104 A/B, Adhesive Product


Adhesive Product

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Our adhesive product line includes a series of one and two part room and thermal cure epoxy adhesives as well as UV curable adhesives. These adhesives are used in a wide range of applications meeting the customers' most demanding requirements: high strength at elevated temperatures, low stress for mismatched thermal expansion applications and outstanding chemical resistance for harsh environments.

High strength, excellent chemical resistance




Specifications  · Handling  · Physical  · Thermal  · Electrical  · Applications

Specifications

Type
High Temperature

Catalyst
Part B


Handling

Viscosity at 25 ºC
25000 cps

Mix Ratio (wt)
100:64

Cure Schedule
Heat

Working Life at 25 ºC
> 12 h


Physical

Specific Gravity
1.4 g/cc

Hardness
90 D

Tensile Strength
12.4 psi


Thermal

Thermal Conductivity
0.45 W/m·K

Glass Transition Temperature
> 225 ºC

Service Temperature
–25 to 230 ºC


Electrical

Dielectric Strength
400 V/mil

Volume Resistivity at 25 ºC
1 x 1015 O/cm


Applications

Application considerations

Surface preparation: The first step in all adhesive applications. Substrate surfaces must be clean from dust, dirt and oils to maximize the adhesive bond strength.

Wetting: Essential to adhesive bonding. Gaps or bubbles in the bondline reduce the area of contact between the adhesive and substrate thus results in lower bond strengths.

Shrinkage: Adhesive shrinkage during cure may result in stresses at the interface leading to cracks. Flexible adhesives are better able to adjust to shrinkage induced stress than rigid systems.

Curing: Heat and room temperature cure adhesives are available to meet your application requirements of throughput and temperature ceilings.