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Specialty Materials for Electronic Assembly
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Film-FEP Backing Substrates
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Film-FEP Backing Substrates
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FEP film is used for applications requiring optical clarity, quick release, and abrasion resistance. FEP film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
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Results 1 - 2 of 2
1
Item #
Color
Adhesive System
Backing Thickness
Adhesive Thickness
Total Thickness
Adhesion Strength
C
Clear
S
2.0
mil
0.051
mm
1.5
mil
0.038
mm
3.5
mil
0.089
mm
20
oz/in
220
g/cm
2355-2
Clear
S
2.0
mil
0.051
mm
1.5
mil
0.038
mm
3.5
mil
0.089
mm
20
oz/in
220
g/cm
Results 1 - 2 of 2
1
Specialty Materials for Electronic Assembly
Specialty Materials for Electronic Assembly