Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electrically Conductive Tape & Composite Adhesives > Composite Bonding Tapes > Film-FEP Backing Substrates > Item # C  
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Item # C, Film-FEP Backing Substrates


Film-FEP Backing Substrates

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FEP film is used for applications requiring optical clarity, quick release, and abrasion resistance. FEP film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.




 Specifications   

Color
Clear

Adhesive System
S

Backing Thickness
2.0 mil
0.051 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
3.5 mil
0.089 mm

Adhesion Strength
20 oz/in
220 g/cm

Tensile Strength
8 lb/in
1.4 kg/cm

Elongation
275 %

Dielectric
9.0 kV

Insulation Class
155 ºC

Min Temperature Range
-100 ºF
-73 ºC

Max Temperature Range
400 ºC
204 ºF

Comments
Food/Medical Grade