Film-backing, heat-resistant tape that provides less shrinkage after heated. Withstands various types of heating processes applied during semiconductor or electronic component production.
Specifications
Film Type |
N/A Polyethylene |
Adhesive System |
N/A Silicone |
Total Tape Thickness |
N/A 0.17 mm |
Adhesion Strength |
N/A 5.1 N/10mm |
Tensile Strength |
N/A 102 N/10mm |
Elongation |
N/A 174 % |
Flame Retardant |
N/A No |
Description |
N/A Special Polyester Tape Clear |
Tape Glossary
N/A
ASTM |