Item # T725, THERMFLOW Phase-Change Thermal Interface Pads On Robert McKeown Co., Inc.

All Categories > Thermal Interface Materials > Phase Change Thermal Interface > THERMFLOW Phase-Change Thermal Interface Pads > Item # T725


	Item # T725, THERMFLOW Phase-Change Thermal Interface Pads

larger image

THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules.

The key feature of THERMFLOW materials is their phase-change characteristic. At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces, similar to thermal grease. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to outperform nonflowing elastomeric or graphite-based thermal pads and achieve performance comparable to thermal grease.

THERMFLOW materials are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly, THERMFLOW pads should not be used as electrical insulators.

Specifications

Test Method Color		Visual

Color		Pink

Carrier		None - Free film

Test Method Thicknesses		ASTM D374

Standard Thickness		0.125 mm 0.005 in

Test Method Specific Gravity		ASTM D792

Specific Gravity		1.1

Test Method Phase Transition Temperature		ASTM 3418

Phase Transition Temperature		55 ºC

Weight Loss, 125 ºC for 48 h		< 0.5 %

Test Method Thermal Impendance		ASTM D5470

Thermal Impendance at 70 ºC, at 69 kPa (10 psi)		0.71 ºC-cm²/W 0.11 ºC-in²/W

Thermal Impendance at 70 ºC, at 172 kPa (25 psi)		0.39 ºC-cm²/W 0.06 ºC-in²/W

Thermal Impendance at 70 ºC, at 345 kPa (50 psi)		0.26 ºC-cm²/W 0.04 ºC-in²/W

Operating Temperature Range		–55 to 125 ºC –67 to 257 ºF

Test Method Volume Resistivity		ASTM D257

Volume Resistivity		10¹⁴ O/cm

Test Method Voltage Breakdown		ASTM D149

Test Method Flammability Rating		UL 94

Flammability Rating		V-0

Test Method RoHS Compliant		Chomeric Certification

RoHS Compliant		Yes

Test Method Shelf Life		Chomerics

Shelf Life, Months from Date of Shipment		12

Item # T725, THERMFLOW Phase-Change Thermal Interface Pads

Test Method Color

Color

Carrier

Test Method Thicknesses

Standard Thickness

Test Method Specific Gravity

Specific Gravity

Test Method Phase Transition Temperature

Phase Transition Temperature

Weight Loss, 125 ºC for 48 h

Test Method Thermal Impendance

Thermal Impendance at 70 ºC, at 69 kPa (10 psi)

Thermal Impendance at 70 ºC, at 172 kPa (25 psi)

Thermal Impendance at 70 ºC, at 345 kPa (50 psi)

Operating Temperature Range

Test Method Volume Resistivity

Volume Resistivity

Test Method Voltage Breakdown

Test Method Flammability Rating

Flammability Rating

Test Method RoHS Compliant

RoHS Compliant

Test Method Shelf Life

Shelf Life, Months from Date of Shipment