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THERMFLOW™ materials are thermally
enhanced polymers designed to
minimize the thermal resistance
between power dissipating electronic
components and their associated heat
sinks. This low thermal resistance path
maximizes heat sink performance and
improves the reliability of microprocessors,
memory modules, DC/DC converters
and power modules.
The key feature of THERMFLOW materials
is their phase-change characteristic.
At room temperature, THERMFLOW
materials are solid and easy to handle.
This allows them to be consistently and
cleanly applied as dry pads to a heat
sink or component surface. THERMFLOW
material softens as it reaches
component operating temperatures.
With light clamping pressure it ...
Specialty Materials for Electronic Assembly
