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Application considerations
Surface preparation: The first step in all adhesive applications. Substrate surfaces must be clean from dust, dirt and oils to maximize the adhesive bond strength.
Wetting: Essential to adhesive bonding. Gaps or bubbles in the bondline reduce the area of contact between the adhesive and substrate thus results in lower bond strengths.
Shrinkage: Adhesive shrinkage during cure may result in stresses at the interface leading to cracks. Flexible adhesives are better able to adjust to shrinkage induced stress than rigid systems.
Curing: Heat and room temperature cure adhesives are available to meet your application requirements of throughput and temperature ceilings.
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