• Paper Backing Substrates
Paper tapes are designed to provide high temperature and excellent solvent resistance for wave soldering, printed circuit board masking, and hot air leveling applications. Service temperatures range from -100°F to 500°F (-73°C to +260°C).
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Part Number

Color

Adhesive System

Backing Thickness

Adhesive Thickness

Total Thickness

Adhesion Strength

N/A Natural N/A S N/A 4.0 mil0.102 mm N/A 2.0 mil0.051 mm N/A 6.0 mil0.152 mm N/A 30 oz/in331 g/cm
N/A Red N/A S N/A 6.5 mil0.165 mm N/A 3.0 mil0.076 mm N/A 9.5 mil0.241 mm N/A 60 oz/in661 g/cm
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