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Specialty Materials for Electronic Assembly
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Glass-Silicone Backing Substrates
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Glass-Silicone Backing Substrates
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Silicone glass provides temperature resistance from -85°F to +500°F (-62°C to +260°C) and exceptional tensile strength and abrasion resistance. Applications include thermal spray, grit blasting, electrical and thermal insulation gaskets, heat sealing, and diaphragms.
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Results 1 - 5 of 5
1
Item #
Color
Adhesive System
Backing Thickness
Adhesive Thickness
Total Thickness
Adhesion Strength
23816
White
S
8.0
mil
0.203
mm
4.0
mil
0.102
mm
12.0
mil
0.305
mm
50
oz/in
551
g/cm
2965-8R
Blue
S
7.0
mil
0.178
mm
3.5
mil
0.089
mm
10.5
mil
0.267
mm
45
oz/in
496
g/cm
2975-8R
White
S
7.0
mil
0.178
mm
3.5
mil
0.089
mm
10.5
mil
0.267
mm
50
oz/in
551
g/cm
H7575
White
S
17.5
mil
0.440
mm
3.5
mil
0.089
mm
21.0
mil
0.553
mm
50
oz/in
551
g/cm
H7525
White
S
15.0
mil
0.380
mm
2.5
mil
0.064
mm
17.5
mil
0.445
mm
50
oz/in
551
g/cm
Results 1 - 5 of 5
1