• Film-FEP Backing Substrates
FEP film is used for applications requiring optical clarity, quick release, and abrasion resistance. FEP film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
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Item #

Color

Adhesive System

Backing Thickness

Adhesive Thickness

Total Thickness

Adhesion Strength

C N/A Clear N/A S N/A 2.0 mil0.051 mm N/A 1.5 mil0.038 mm N/A 3.5 mil0.089 mm N/A 20 oz/in220 g/cm
2355-2 N/A Clear N/A S N/A 2.0 mil0.051 mm N/A 1.5 mil0.038 mm N/A 3.5 mil0.089 mm N/A 20 oz/in220 g/cm
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