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CHO-FOIL EMI Shielding Tape with Conductive Adhesive (Copper, Aluminum or Tinned Copper)

Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring surface conductivity only. An embossed version of CHO-FOIL copper tape is also available, for a more attractive appearance up to 6 inches (152 mm) wide. Standard length rolls and die-cut custom shapes can be ordered.

CHO-FAB EMI Shielding Fabric Tape with Conductive Adhesive

CHO-FAB tape is a corrosion resistant nickel-plated cloth coated with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FAB tape is extremely strong and lightweight, and has excellent conformability/wrapability to enhance shielding performance and appearance. Use of corrosion resistant nickelplated cloth and Chomerics’ superior metal-particle-filled conductive adhesive technology produces a tape used in a wide variety of EMI shielding and grounding applications.
Unit of Measure

Specifications

Tape Description

 N/A Nickel-plated fabric, conductive adhesive

Tape Width

 N/A 4.0 in102 mm

Part Number Prefix

 N/A CFT

Foil/Fabric Type

 N/A Nickel-Plated Fabric

Foil/Fabric Thickness

 N/A 5 mil0.127 mm

Adhesive Type

 N/A Electrically Conductive, Pressure-Sensitive Acrylic

Adhesive Thickness

 N/A 1.5 mil0.0381 mm
Total Thickness1 N/A 6.5 mil0.165 mm

Temperature Range

 N/A –40 to 180 ºF–40 to 82 ºC

Test Method Flame Resistance

 N/A UL Subject 510

Test Method Adhesion to Aluminum

 N/A ASTM D1000

Adhesion to Aluminum

 N/A > 40 oz/in2.5 ppi438 N/m

Test Method Electrical Resistance

 N/A MIL-STD-202C

Electrical Resistance

 N/A < 0.010 O/in²< 0.0016 O/cm²

Test Method Initial Surface Resistivity

 N/A CHO-TP-57
Initial Surface Resistivity2 N/A < 100 mO

Test Method Initial Through Resistivity

 N/A CHO-TP-57
Initial Through Resistivity3 N/A < 100 mO

Test Method Initial Peel Strength

 N/A ASTM D1000
Initial Peel Strength4 N/A 44.8 oz/in2.8 ppi490 N/m

Test Method Initial Taber Abrasion Surface Resistivity

 N/A CHO-TP-57

Initial Taber Abrasion Surface Resistivity

 N/A < 100 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity

 N/A CHO-TP-57

Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity

 N/A < 100 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity

 N/A CHO-TP-57
Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity5 N/A < 150 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Peel

 N/A ASTM D1000

Heat Aging 185 ºF (85 ºC)/168 h, Peel

 N/A 59.2 oz/in3.7 ppi648 N/m

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity

 N/A CHO-TP-57

Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity

 N/A < 100 mO

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity

 N/A CHO-TP-57

Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity

 N/A < 150 mO

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Peel

 N/A ASTM D1000

Heat Aging 250 ºF (121 ºC)/168 h, Peel

 N/A 43.2 oz/in2.7 ppi473 N/m

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity

 N/A CHO-TP-57

Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity

 N/A < 100 mO

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity

 N/A CHO-TP-57

Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity

 N/A < 150 mO

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel

 N/A ASTM D1000

Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel

 N/A 46.4 oz/in2.9 ppi508 N/m

Test Method Salt Fog Corrosion/168 h, Surface Resistivity

 N/A CHO-TP-57

Salt Fog Corrosion/168 h, Surface Resistivity

 N/A < 100 mO

Test Method Salt Fog Corrosion/168 h, Through Resistivity

 N/A CHO-TP-57

Salt Fog Corrosion/168 h, Through Resistivity

 N/A < 1000 mO

Test Method Salt Fog Corrosion/168 h, Peel

 N/A ASTM D1000

Salt Fog Corrosion/168 h, Peel

 N/A 33.6 oz/in2.1 ppi368 N/m

Test Method Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles

 N/A CHO-TP-57

Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles

 N/A < 175 mO

Ordering Procedure

N/A
All CHOFOIL and CHO-FAB tapes are available in standard 36 yard (32.9 m) rolls or die-cut custom configurations. Call Chomerics’ Applications Engineering Department for assistance with a custom configuration.

Applications

N/A
Typical Applications for CHO-FOIL and CHO-FAB EMI Shielding Tapes

  • Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell
  • EMI radiation measurement troubleshooting, using CHOFOIL tape to shield ventilation slots or seam gaps
  • Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures
  • Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum
  • EMI shield for cables by wrapping the tape around the cable. An overlap is recommended
  • ESD shielding
  • Provide corrosion-resistant ground contact points
  • Fabric tape available where weight and flexibility are important, such as for wrapping cables

    		•
    • 1 Embossing adds 1.1 mil.
    • 2 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.
    • 3 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.

      For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.
    • 4 90° peel strength tests were done on an Instron at 2 inches per minute with tapes on a 2024 aluminum substrate.
    • 5 For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.