Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
Two components, nickel filled adhesive.
Two components, nickel filled adhesive.
Unit of Measure
Max. Volume Resistivity |
N/A 0.02 O/cm |
Certified to MIL-STD-883, Method 5011 |
N/A No |
Viscosity |
N/A Paste |
Work Life at Room Temperature |
N/A 40 min |
Cure |
N/A 24 h at 25 ºC |
Secondary Cure Option |
N/A 30 min at 100 ºC |
Lap Shear Strength |
N/A 800 psi |
Conductivity |
N/A 1.44 W/m·K |
CTE Below Tg |
N/A 45 ppm/ºC |