Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
High purity, die attach adhesive
High purity, die attach adhesive
Unit of Measure
Max. Volume Resistivity |
N/A 9 x 10-4 O/cm |
Certified to MIL-STD-883, Method 5011 |
N/A Yes |
Viscosity |
N/A 60000 cps |
Work Life at Room Temperature |
N/A 3 days |
Cure |
N/A 30 min at 150 ºC |
Die Shear Strength |
N/A 3500 psi |
Conductivity |
N/A 4.5 W/m·K |
Tg |
N/A 117 ºC |
CTE Below Tg |
N/A 52 ppm/ºC |
CTE Above Tg |
N/A 150 ppm/ºC |