General purpose, very thick paste, requires no contact pres sure for cure and is less conductive.
Unit of Measure
Filler |
N/A Ag, Ag/Cu |
Resin Type (Parts) |
N/A epoxy (2) |
Specific Gravity |
N/A 4.0 g/cc |
Max. Volume Resistivity |
N/A 0.010 O/cm |
Lap Shear Min. |
N/A 1400 psi9653 kPa |
Elevated Temperature Cure Cycle Time |
N/A 0.75 h at 212 °F (100 ºC) |
RT Cure Time |
N/A 24 h |
Working Life |
N/A 1 h |
Shelf Life at RT (Mos.) |
N/A 9 |
Recommended Primer |
N/A 1086 |
Application |
N/A Bonding enclosures |
