General purpose, very thick paste, fast heat/RT cure, < 0.254 mm bond lines.
Unit of Measure
Filler |
N/A Ag/Cu |
Resin Type (Parts) |
N/A epoxy (2) |
Specific Gravity |
N/A 5.0 g/cc |
Max. Volume Resistivity |
N/A 0.005 O/cm |
Lap Shear Min. |
N/A 1600 psi11032 kPa |
Elevated Temperature Cure Cycle Time |
N/A 2 h at 150 °F (66 ºC) |
RT Cure Time |
N/A 24 h |
Working Life |
N/A 1 h |
Shelf Life at RT (Mos.) |
N/A 9 |
Application |
N/A EMI gasket attachment, bonding enclosures |
