Film-Polyimide Backing Substrates
Polyimide Film
Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C).
These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.
Unit of Measure
Items |
/Asset/pic28.jpg 2345-1 Film-Polyimide Backing Substrates |
/Asset/pic28.jpg 2345-2 Film-Polyimide Backing Substrates |
/Asset/pic28.jpg 2345-5 Film-Polyimide Backing Substrates |
/Asset/pic28.jpg K104 Film-Polyimide Backing Substrates |
/Asset/pic28.jpg K201 Film-Polyimide Backing Substrates |
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Color | N/A Amber | |||||||||
Adhesive System | N/A S | |||||||||
Backing Thickness | N/A 1.0 mil0.025 mm | N/A 2.0 mil0.051 mm | N/A 5.0 mil0.127 mm | N/A 0.5 mil0.013 mm | N/A 1.0 mil0.025 mm | |||||
Adhesive Thickness | N/A 1.5 mil0.038 mm | N/A 1.5 mil0.038 mm | N/A 1.5 mil0.038 mm | N/A 1.0 mil0.025 mm | N/A 1.5 mil0.038 mm | |||||
Total Thickness | N/A 2.5 mil0.064 mm | N/A 3.5 mil0.089 mm | N/A 6.5 mil0.165 mm | N/A 1.5 mil0.038 mm | N/A 2.5 mil0.064 mm | |||||
Adhesion Strength | N/A 25 oz/in276 g/cm | N/A 25 oz/in276 g/cm | N/A 20 oz/in221 g/cm | N/A 15 oz/in165 g/cm | N/A 25 oz/in276 g/cm | |||||
Tensile Strength | N/A 30 lb/in5.4 kg/cm | N/A 50 lb/in8.9 kg/cm | N/A 150 lb/in26.8 kg/cm | N/A 10 lb/in1.8 kg/cm | N/A 30 lb/in5.4 kg/cm | |||||
Elongation | N/A 50 % | N/A 75 % | N/A 75 % | N/A 25 % | N/A 50 % | |||||
Dielectric | N/A 6.5 kV | N/A 10.0 kV | N/A 17.0 kV | N/A 4.0 kV | N/A | |||||
Insulation Class | N/A 180 ºC | |||||||||
Min Temperature Range | N/A -100 ºF-73 ºC | |||||||||
Max Temperature Range | N/A 500 ºF260 ºC | |||||||||
Comments | N/A UL Guide OANZ2,File E66639,UL510 | N/A UL Guide OANZ2,File E66639,UL510 | N/A | N/A | N/A Masking grade | |||||
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