Paper tapes are designed to provide high temperature and excellent solvent resistance for wave soldering, printed circuit board masking, and hot air leveling applications. Service temperatures range from -100°F to 500°F (-73°C to +260°C).
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Paper Backing Substrates

Paper Backing Substrates
Paper Backing Substrates

Paper Backing Substrates
Color N/A Natural N/A Red
Adhesive System N/A S
Backing Thickness N/A 4.0 mil0.102 mm N/A 6.5 mil0.165 mm
Adhesive Thickness N/A 2.0 mil0.051 mm N/A 3.0 mil0.076 mm
Total Thickness N/A 6.0 mil0.152 mm N/A 9.5 mil0.241 mm
Adhesion Strength N/A 30 oz/in331 g/cm N/A 60 oz/in661 g/cm
Tensile Strength N/A 25 lb/in4.5 kg/cm N/A
Elongation N/A 5 % N/A
Insulation Class N/A 155 ºC N/A
Min Temperature Range N/A -20 ºF-29 ºC N/A -100 ºF-73 ºC
Max Temperature Range N/A 310 ºF154 ºC N/A 500 ºF260 ºC
Comments N/A Static Dissipative (ESD) N/A