Film-FEP Backing Substrates
Composite Bonding Tapes
FEP film is used for applications requiring optical clarity, quick release, and abrasion resistance. FEP film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Unit of Measure
Items |
/Asset/pic56.jpg C Film-FEP Backing Substrates |
/Asset/pic56.jpg 2355-2 Film-FEP Backing Substrates |
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Color | N/A Clear | |||
Adhesive System | N/A S | |||
Backing Thickness | N/A 2.0 mil0.051 mm | |||
Adhesive Thickness | N/A 1.5 mil0.038 mm | |||
Total Thickness | N/A 3.5 mil0.089 mm | |||
Adhesion Strength | N/A 20 oz/in220 g/cm | |||
Tensile Strength | N/A 8 lb/in1.4 kg/cm | |||
Elongation | N/A 275 % | |||
Dielectric | N/A 9.0 kV | |||
Insulation Class | N/A 155 ºC | |||
Min Temperature Range | N/A -100 ºF-73 ºC | |||
Max Temperature Range | N/A 400 ºC204 ºF | |||
Comments | N/A Food/Medical Grade | N/A | ||
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