Robert Mckeown Co., Inc
111 Chambers Brook Rd.
Branchburg, NJ 08876 US
Phone: 908.218.9000 • Fax: 908.218.8949
Email: sales@robertmckeown.com
All Categories > Thermal Interface Materials > Phase Change Thermal Interface > THERMFLOW Phase-Change Thermal Interface Pads > Item # T777  


Phase-Change

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Item # T777, THERMFLOW Phase-Change Thermal Interface Pads

THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules.

The key feature of THERMFLOW materials is their phase-change characteristic. At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces, similar to thermal grease. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to outperform nonflowing elastomeric or graphite-based thermal pads and achieve performance comparable to thermal grease.

THERMFLOW materials are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly, THERMFLOW pads should not be used as electrical insulators.



 Specifications 

Test Method Color
Visual

Color
Gray

Carrier
None - Free film

Test Method Thicknesses
ASTM D374

Standard Thickness
0.115 mm
0.0045 in

Test Method Specific Gravity
ASTM D792

Specific Gravity
1.95

Test Method Phase Transition Temperature
ASTM 3418

Phase Transition Temperature
45/62 ºC

Weight Loss, 125 ºC for 48 h
< 0.5 %

Test Method Thermal Impendance
ASTM D5470

Thermal Impendance at 70 ºC, at 69 kPa (10 psi)
0.13 ºC-cm²/W
0.02 ºC-in²/W

Thermal Impendance at 70 ºC, at 172 kPa (25 psi)
0.097 ºC-cm²/W
0.015 ºC-in²/W

Thermal Impendance at 70 ºC, at 345 kPa (50 psi)
0.035 ºC-cm²/W
0.008 ºC-in²/W

Operating Temperature Range
–55 to 125 ºC
–67 to 257 ºF

Test Method Volume Resistivity
ASTM D257

Volume Resistivity
Nonconductive

Test Method Voltage Breakdown
ASTM D149

Test Method Flammability Rating
UL 94

Flammability Rating
V-0

Test Method RoHS Compliant
Chomeric Certification

RoHS Compliant
Yes

Test Method Shelf Life
Chomerics

Shelf Life, Months from Date of Shipment
12