Specialty Materials for Electronic Assembly
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Item # Ql-9226 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants



Two-part; semi-flowable




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type

Thermally Conductive Adhesives

Product Form

Two-Part

Color

Gray

Viscosity

50000 mPa/s

Durometer

66 A

Tensile Strength

508 psi
3.5
MPa
35.7
kgf/cm²

Elongation

110 %

Specific Gravity

2.13

Working Time at Room Temperature1

16 h

Heat Cure Time at 100 ºC (212 ºF)2

60 min

Heat Cure Time at 150 ºC (302 ºF)3

30 min

Thermal Conductivity4

0.74 W/m·K

Shelf Life from Date of Manufacture

12 months

Dielectric Strength

635 V/mil
25
kV/mm

Dielectric Constant at 100 kHz

4.5

Dissipation Factor at 100 kHz

0.0013

Volume Resistivity

1.90E+14 O/cm
1 Time to double initial mixed viscosity.
2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
4 Thermal Conductivity at 25 ºC (77 ºF)


Features

Long pot life; rapid heat cure; self-priming



Potential Uses

Bonding hybrids or microprocessors to heat sinks



Application Methods

Automated or manual dispensing