Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Adhesives & Sealants > Silicone Adhesive/Sealants > Thermally Conductive Silicone Adhesive/Sealants > Dow Electronics Thermally Conductive Adhesives/Sealants > Item # 3-1818 Adhesive  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # 3-1818 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants


EMI Shielding Electrical Tape

larger image
One-part; gray




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type
Thermally Conductive Adhesives

Product Form
One-Part

Color
Gray

Viscosity
68700 mPa/s

Durometer
88 A

Tensile Strength
625 psi
4.3 MPa
43.9 kgf/cm²

Elongation
20 %

Specific Gravity
2.6

Linear CTE
137 µ/mC

Heat Cure Time at 100 ºC (212 ºF)1
60 min

Heat Cure Time at 125 ºC (257 ºF)2
45 min

Heat Cure Time at 150 ºC (302 ºF)3
10 min

Unprimed Adhesion Lap Shear
510 psi
352 N/cm²
35.9 kgf/cm²

Thermal Conductivity4
1.8 W/m·K

Shelf Life from Date of Manufacture
6 months

Dielectric Strength
395 V/mil
15.6 kV/mm

Dielectric Constant at 100 Hz
5.6

Dielectric Constant at 100 kHz
5.5

Dissipation Factor at 100 Hz
0.0059

Dissipation Factor at 100 kHz
< 0.0002

Volume Resistivity
6.85E+13 O/cm
1 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
4 Thermal Conductivity at 25 ºC (77 ºF)


Features

Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; contains 7-mil (178 micron) glass beads for bond line control


Potential Uses

Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates


Application Methods

Manual or automated dispensing