Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulants > Item # Sylgard® 184 Silicone Elastomer  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # Sylgard® 184 Silicone Elastomer, Silicone Potting/Encapsulants


Silicone-Potting-Encapsulants

larger image
2-part, 10:1 mix, transparent encapsulant with good flame resistance




Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Silicone Encapsulants

Mix Ratio
10:1

Color
Clear

Viscosity
4575 mPa/s

Durometer
48

Specific Gravity
1.03

Working Time at Room Temperature
> 2 h

Flammability Classification
94 V-1

UL Temperature Index, Electrical/Mechanical
130/130 ºC

Thermal Conductivity
0.16 W/m·K
3.8 x 10-4 cal/cm·s-ºC

Linear Coefficient of Thermal Expansion
325 ppm

Shelf Life from Date of Manufacture
24 months

Military Specification
MIL-I- 81550C

Type, Class, Group
Type I, QPL

Dielectric Strength
350 V/mil
14 kV/mm

Dielectric Constant at 100 Hz
2.72

Dielectric Constant at 100 kHz
2.68

Dissipation Factor at 100 Hz
0.0026

Dissipation Factor at 100 kHz
0.0013

Volume Resistivity
2.9 x 1014 O/cm


Features

10:1 mix ratio; flowable; room temperature or heat cure; high tensile strength; same as Sylgard* 182 Elastomer but with RT cure capability; UL recognized; Mil Spec approved


Potential Uses

General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays; adhe- sive/encapsulant for solar cells; adhesive handling beam lead integrated circuits during processing


Application Methods

Supplied as two-part liquid component kits comprised of Base/Curing Agent to be mixed in a 10:1 ratio by weight or volume; automated mixing and dispensing; manual mixing


Cure

> 48 hours at room temperature
35 minutes at 100 °C (212 °F)
20 minutes at 125 °C (257 °F)
10 minutes at 150 °C (302 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.