Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 5954  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # 5954, Epoxy Encapsulant Product


Epoxy Encapsulant Product

larger image
Silicone, high temperature, easy mix ratio




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Thermally Conductive

Catalyst
Part B


Handling

Viscosity at 25 ºC
35000 cps

Mix Ratio (wt)
100:100

Cure Schedule
Room


Physical

Specific Gravity
2.45 g/cc

Hardness
85 A

Tensile Strength
400 psi


Thermal

CTE
150 ppm/ºC

Thermal Conductivity
1.15 W/m·K

Service Temperature
–65 to 260 ºC


Electrical

Dielectric Strength
40 V/mil

Dielectric Constant at 1 MHz
5.0

Volume Resistivity at 25 ºC
1 x 1014 O/cm