Item # 5954, Epoxy Encapsulant Product On Robert McKeown Co., Inc.

Robert Mckeown Co., Inc
111 Chambers Brook Rd.
Branchburg, NJ 08876 US
Phone: 908.218.9000 • Fax: 908.218.8949
Email: sales@robertmckeown.com


All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 5954

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Item # 5954, Epoxy Encapsulant Product

Silicone, high temperature, easy mix ratio

Specifications · Handling · Physical · Thermal · Electrical

Specifications

Type		Thermally Conductive

Catalyst		Part B

Handling

Viscosity at 25 ºC		35000 cps

Mix Ratio (wt)		100:100

Cure Schedule		Room

Physical

Specific Gravity		2.45 g/cc

Hardness		85 A

Tensile Strength		400 psi

Thermal

CTE		150 ppm/ºC

Thermal Conductivity		1.15 W/m·K

Service Temperature		–65 to 260 ºC

Electrical

Dielectric Strength		40 V/mil

Dielectric Constant at 1 MHz		5.0

Volume Resistivity at 25 ºC		1 x 10¹⁴ O/cm

Item # 5954, Epoxy Encapsulant Product

Type

Catalyst

Viscosity at 25 ºC

Mix Ratio (wt)

Cure Schedule

Specific Gravity

Hardness

Tensile Strength

CTE

Thermal Conductivity

Service Temperature

Dielectric Strength

Dielectric Constant at 1 MHz

Volume Resistivity at 25 ºC