Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1495K/Catalyst 23LV  
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Item # 1495K/Catalyst 23LV, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Low viscosity, thermally conductive




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Thermally Conductive

Catalyst
23LV


Handling

Viscosity at 25 ºC
10000 cps

Mix Ratio (wt)
100:9

Cure Schedule
Room


Physical

Specific Gravity
1.82 g/cc

Hardness
90 D

Tensile Strength
7100 psi


Thermal

CTE
37 ppm/ºC

Thermal Conductivity
1 W/m·K

Service Temperature
–65 to 105 ºC


Electrical

Dielectric Strength
400 V/mil

Dielectric Constant at 1 MHz
4.00