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Item # 1495K/Catalyst 23LV, Epoxy Encapsulant Product


Low viscosity, thermally conductive





Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type

Thermally Conductive

Catalyst

23LV


Handling

Viscosity at 25 ºC

10000 cps

Mix Ratio (wt)

100:9

Cure Schedule

Room


Physical

Specific Gravity

1.82 g/cc

Hardness

90 D

Tensile Strength

7100 psi


Thermal

CTE

37 ppm/ºC

Thermal Conductivity

1 W/m·K

Service Temperature

–65 to 105 ºC


Electrical

Dielectric Strength

400 V/mil

Dielectric Constant at 1 MHz

4.00