Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1266  
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Item # 1266, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Clear, low viscosity, moisture resistant




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
Part B


Handling

Viscosity at 25 ºC
650 cps

Mix Ratio (wt)
100:28

Cure Schedule
Room


Physical

Specific Gravity
1.15 g/cc

Hardness
75 D

Tensile Strength
6000 psi


Thermal

CTE
80 ppm/ºC

Thermal Conductivity
0.26 W/m·K

Service Temperature
–65 to 105 ºC


Electrical

Dielectric Strength
400 V/mil

Dielectric Constant at 1 MHz
3.0

Volume Resistivity at 25 ºC
3 x 1014 O/cm