Robert Mckeown Co., Inc
111 Chambers Brook Rd.
Branchburg, NJ 08876 US
Phone:
908.218.9000 •
Fax:
908.218.8949
Email:
sales@robertmckeown.com
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Electronics Potting & Encapsulation
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Epoxy Encapsulant Product
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Item # 1266
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Item # 1266, Epoxy Encapsulant Product
Clear, low viscosity, moisture resistant
Specifications
·
Handling
·
Physical
·
Thermal
·
Electrical
Specifications
Type
Low Viscosity
Catalyst
Part B
Handling
Viscosity at 25 ºC
650
cps
Mix Ratio (wt)
100:28
Cure Schedule
Room
Physical
Specific Gravity
1.15
g/cc
Hardness
75 D
Tensile Strength
6000
psi
Thermal
CTE
80
ppm/ºC
Thermal Conductivity
0.26
W/m·K
Service Temperature
–65 to 105
ºC
Electrical
Dielectric Strength
400
V/mil
Dielectric Constant at 1 MHz
3.0
Volume Resistivity at 25 ºC
3 x 10
14
O/cm
