Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1265  
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Item # 1265, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Two component, clear, soft gel




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
Part B


Handling

Viscosity at 25 ºC
600 cps

Mix Ratio (wt)
100:100

Cure Schedule
Room


Physical

Specific Gravity
1.08 g/cc

Hardness
25 A

Tensile Strength
1058 psi


Thermal

Service Temperature
–40 to 65 ºC


Electrical

Dielectric Constant at 1 MHz
3.0

Volume Resistivity at 25 ºC
1 x 1012 O/cm