Item # 1265, Epoxy Encapsulant Product On Robert McKeown Co., Inc.

Robert Mckeown Co., Inc
111 Chambers Brook Rd.
Branchburg, NJ 08876 US
Phone: 908.218.9000 • Fax: 908.218.8949
Email: sales@robertmckeown.com


All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1265

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Item # 1265, Epoxy Encapsulant Product

Two component, clear, soft gel

Specifications · Handling · Physical · Thermal · Electrical

Specifications

Type		Low Viscosity

Catalyst		Part B

Handling

Viscosity at 25 ºC		600 cps

Mix Ratio (wt)		100:100

Cure Schedule		Room

Physical

Specific Gravity		1.08 g/cc

Hardness		25 A

Tensile Strength		1058 psi

Thermal

Service Temperature		–40 to 65 ºC

Electrical

Dielectric Constant at 1 MHz		3.0

Volume Resistivity at 25 ºC		1 x 10¹² O/cm

Item # 1265, Epoxy Encapsulant Product

Type

Catalyst

Viscosity at 25 ºC

Mix Ratio (wt)

Cure Schedule

Specific Gravity

Hardness

Tensile Strength

Service Temperature

Dielectric Constant at 1 MHz

Volume Resistivity at 25 ºC