Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1090/Catalyst 23LV  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # 1090/Catalyst 23LV, Epoxy Encapsulant Product


Epoxy Encapsulant Product

larger image
Lightweight, syntactic foam




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
23LV


Handling

Viscosity at 25 ºC
5000 cps

Mix Ratio (wt)
100:18.5

Cure Schedule
Room


Physical

Specific Gravity
0.81 g/cc

Hardness
75 D

Tensile Strength
3900 psi


Thermal

Thermal Conductivity
0.19 W/m·K

Service Temperature
–65 to 105 ºC


Electrical

Dielectric Constant at 1 MHz
2.75

Volume Resistivity at 25 ºC
1 x 1013 O/cm