Item # 1090/Catalyst 23LV, Epoxy Encapsulant Product On Robert McKeown Co., Inc.

Robert Mckeown Co., Inc
111 Chambers Brook Rd.
Branchburg, NJ 08876 US
Phone: 908.218.9000 • Fax: 908.218.8949
Email: sales@robertmckeown.com


All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1090/Catalyst 23LV

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Item # 1090/Catalyst 23LV, Epoxy Encapsulant Product

Lightweight, syntactic foam

Specifications · Handling · Physical · Thermal · Electrical

Specifications

Type		Low Viscosity

Catalyst		23LV

Handling

Viscosity at 25 ºC		5000 cps

Mix Ratio (wt)		100:18.5

Cure Schedule		Room

Physical

Specific Gravity		0.81 g/cc

Hardness		75 D

Tensile Strength		3900 psi

Thermal

Thermal Conductivity		0.19 W/m·K

Service Temperature		–65 to 105 ºC

Electrical

Dielectric Constant at 1 MHz		2.75

Volume Resistivity at 25 ºC		1 x 10¹³ O/cm

Item # 1090/Catalyst 23LV, Epoxy Encapsulant Product

Type

Catalyst

Viscosity at 25 ºC

Mix Ratio (wt)

Cure Schedule

Specific Gravity

Hardness

Tensile Strength

Thermal Conductivity

Service Temperature

Dielectric Constant at 1 MHz

Volume Resistivity at 25 ºC