Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1090/Catalyst 11  
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Item # 1090/Catalyst 11, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Lightweight, syntactic foam




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
11


Handling

Viscosity at 25 ºC
29000 cps

Mix Ratio (wt)
100:10.5

Cure Schedule
Heat


Physical

Specific Gravity
0.80 g/cc

Hardness
82 D

Tensile Strength
4700 psi


Thermal

CTE
40 ppm/ºC

Thermal Conductivity
0.19 W/m·K

Service Temperature
–55 to 155 ºC


Electrical

Dielectric Strength
375 V/mil

Dielectric Constant at 1 MHz
2.73

Volume Resistivity at 25 ºC
1 x 1013 O/cm