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Item # 1090/Catalyst 11, Epoxy Encapsulant Product


Lightweight, syntactic foam





Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type

Low Viscosity

Catalyst

11


Handling

Viscosity at 25 ºC

29000 cps

Mix Ratio (wt)

100:10.5

Cure Schedule

Heat


Physical

Specific Gravity

0.80 g/cc

Hardness

82 D

Tensile Strength

4700 psi


Thermal

CTE

40 ppm/ºC

Thermal Conductivity

0.19 W/m·K

Service Temperature

–55 to 155 ºC


Electrical

Dielectric Strength

375 V/mil

Dielectric Constant at 1 MHz

2.73

Volume Resistivity at 25 ºC

1 x 1013 O/cm