Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Polyimide Films > Film-Polyimide Backing Substrates > Part Number K109  
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Part Number K109, Film-Polyimide Backing Substrates


Film-Polyimide Backing Substrates

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Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.




 Specifications   

Color
Amber

Adhesive System
A

Backing Thickness
2.0 mil
0.051 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
3.5 mil
0.089 mm

Adhesion Strength
30 oz/in
331 g/cm

Tensile Strength
50 lb/in
8.9 kg/cm

Elongation
75 %

Dielectric
10.0 kV

Insulation Class
155 ºC

Min Temperature Range
-20 ºF
-29 ºC

Max Temperature Range
350 ºF
177 ºC