All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Polyimide Films > Film-Polyimide Backing Substrates > Part Number K109  


Part Number K109, Film-Polyimide Backing Substrates


Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.



 Specifications 

Color

Amber

Adhesive System

A

Backing Thickness

2.0 mil
0.051
mm

Adhesive Thickness

1.5 mil
0.038
mm

Total Thickness

3.5 mil
0.089
mm

Adhesion Strength

30 oz/in
331
g/cm

Tensile Strength

50 lb/in
8.9
kg/cm

Elongation

75 %

Dielectric

10.0 kV

Insulation Class

155 ºC

Min Temperature Range

-20 ºF
-29
ºC

Max Temperature Range

350 ºF
177
ºC