Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electrically Conductive Tape & Composite Adhesives > Electrical Insulation and Isolation Tapes > Polyester Films > Film-Polyester Backing Substrates > Item # M887  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # M887, Film-Polyester Backing Substrates


Film-Polyester Backing Substrates

larger image
Polyester films have excellent dimensional stability, high tensile, tear, and impact strengths, and ultimate elongation up to 120% of its original dimensions. These films exhibit low water absorption and good resistance to oils, greases, strong acids, and organic solvents. They also retain electrical properties, dielectric strength and dielectric constant in continuous operating temperatures from -100°F to 350°F (-73°C to 177°C). Applications include transformer and capacitor wrapping, printed circuit board fabrication, splicing tapes, composite bonding protection, and low-cost masking.




 Specifications   

Color
Emerald

Adhesive System
S

Backing Thickness
2.0 mil
0.051 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
3.5 mil
0.089 mm

Adhesion Strength
40 oz/in
441 g/cm

Tensile Strength
50 lb/in
8.9 kg/cm

Elongation
120 %

Dielectric
7.0 kV

Insulation Class
130 ºC

Min Temperature Range
-60 ºF
-51 ºC

Max Temperature Range
350 ºF
177 ºC