All Categories > Electrically Conductive Tape & Composite Adhesives > Electrical Insulation and Isolation Tapes > Polyester Films > Film-Polyester Backing Substrates > Item # M887  


Item # M887, Film-Polyester Backing Substrates


Polyester films have excellent dimensional stability, high tensile, tear, and impact strengths, and ultimate elongation up to 120% of its original dimensions. These films exhibit low water absorption and good resistance to oils, greases, strong acids, and organic solvents. They also retain electrical properties, dielectric strength and dielectric constant in continuous operating temperatures from -100°F to 350°F (-73°C to 177°C). Applications include transformer and capacitor wrapping, printed circuit board fabrication, splicing tapes, composite bonding protection, and low-cost masking.



 Specifications 

Color

Emerald

Adhesive System

S

Backing Thickness

2.0 mil
0.051
mm

Adhesive Thickness

1.5 mil
0.038
mm

Total Thickness

3.5 mil
0.089
mm

Adhesion Strength

40 oz/in
441
g/cm

Tensile Strength

50 lb/in
8.9
kg/cm

Elongation

120 %

Dielectric

7.0 kV

Insulation Class

130 ºC

Min Temperature Range

-60 ºF
-51
ºC

Max Temperature Range

350 ºF
177
ºC