Bond line thickness should not exceed 8 mils Primer promotes adhesion
Unit of Measure
Filler |
N/A Ag/Cu |
Resin Type (Parts) |
N/A silicone (2) |
Specific Gravity |
N/A 3.0 g/cc |
Max. Volume Resistivity |
N/A 0.060 O/cm |
Lap Shear Min. |
N/A 450 psi3103 kPa |
Elevated Temperature Cure Cycle Time |
N/A 0.5 h at 250 oF (121 oC) |
RT Cure Time |
N/A 168 h |
Working Life |
N/A 2 h |
Shelf Life at RT (Mos.) |
N/A 6 |
Recommended Primer |
N/A 1086 (Primer included with product) |
Application |
N/A EMI gasket attachment |
