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Bond line thickness should not exceed 8 mils Primer promotes adhesion
Unit of Measure

Specifications

Filler

N/A Ag/Cu

Resin Type (Parts)

N/A silicone (2)

Specific Gravity

N/A 3.0 g/cc

Max. Volume Resistivity

N/A 0.060 O/cm

Lap Shear Min.

N/A 450 psi3103 kPa

Elevated Temperature Cure Cycle Time

N/A 0.5 h at 250 oF (121 oC)

RT Cure Time

N/A 168 h

Working Life

N/A 2 h

Shelf Life at RT (Mos.)

N/A 6

Recommended Primer

N/A 1086 (Primer included with product)

Application

N/A EMI gasket attachment