Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Microelectronic grade, superior dispense, performance (mil spec. version available).
Unit of Measure

Max. Volume Resistivity

N/A 1 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Viscosity

N/A 30000 cps

Work Life at Room Temperature

N/A 2 weeks

Cure

N/A 2 h at 125 ºC

Secondary Cure Option

N/A 1 h at 150 ºC

Lap Shear Strength

N/A 1650 psi

Die Shear Strength

N/A 6500 psi

Conductivity

N/A 2.4 W/m·K

Tg

N/A 103 ºC

CTE Below Tg

N/A 44 ppm/ºC

CTE Above Tg

N/A 150 ppm/ºC
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